Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Yakaderera-inodhura Aluminium core laminated copper foil SinkPAD PCB

Chii chinonzi Thermoelectric Separation Substrate?

Matunhu edunhu uye thermal pad pane substrate yakaparadzaniswa, uye iyo yekudziya base yezvinopisa zvinosangana zvakananga neinopisa-inoitisa svikiro kuti iwane iyo optimal thermal conductive (zero thermal resistance) mhedzisiro.Izvo zvinhu zve substrate kazhinji isimbi (Copper) substrate.

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Product Detail

PCB tsanangudzo

PCB Type	SinkPAD II Technology
PCB saizi	50.0 × 60.0mm
Shape	Denderedzwa Mabhodhi
Base Metal Type	Aluminium
Pedzisa Kukora	0.062 inches (1.57 mm)
Yakananga Thermal Path	HONGU
Thermal Conductivity	240.0 W/mK
Surface Finish	LF HASL
Girazi Transition Temp.	170 degrees Celsius
UL Yakabvumirwa	Ehe
RoHS Kutevedzera	Ehe