4 Layer PCB Kugadzira Prototype Yakachipa Mutengo PCB Mugadziri muChina

Product Details

Application: Electronics, mauto, mushonga, zvichingodaro

Chitupa: ISO/TS16949/ROHS/TS16949

Solder mask ruvara:Green Nhema Bhuruu White

Nhamba yeLayer: 1-22 Layers

Sevhisi: Nyanzvi injiniya, yakanaka mushure mesevhisi, mutengo wemakwikwi

PCB Standard:IPC-A-610 D/IPC-III Standard

Kushivirira kwegomba:PTH: ±2mil, NTPH: ±2mil

Bhodhi Makobvu Kushivirira: ± 10%


Product Detail

Product Details

Application: Electronics, mauto, mushonga, zvichingodaro

Chitupa: ISO/TS16949/ROHS/TS16949

Solder mask ruvara:Green Nhema Bhuruu White

Nhamba yeLayer: 1-22 Layers

Sevhisi: Nyanzvi injiniya, yakanaka mushure mesevhisi, mutengo wemakwikwi

PCB Standard:IPC-A-610 D/IPC-III Standard

Kushivirira kwegomba:PTH: ±2mil, NTPH: ±2mil

Bhodhi Makobvu Kushivirira: ± 10%

OEM/ODM Services:      
Layer 1-22 layers Min.upamhi hwemutsara 2mil
Max.board size (single&doubledivi) 700*1200mm Min.annular mhete hupamhi: visa 3mil
Surface finish HAL (ine Pb yemahara), yakaiswa Ni/Au,Sirivha yakanyudzwa, IMM Ni/Au, I MM Sn,goridhe rakaoma, OSP, nezvimwewo Min.board ukobvu(multilayer) 4 layers:0.4mm;6 layers:0.6mm;8 layers:1mm;

10 layers:1.2mm

Board zvinhu FR-4;high TG;yakakwirira CTI;halogen yakasununguka;high frequency (rogers, ta-conic,PTFE,nelson,ISOLA, polyclinic 370 HR;mhangura gobvu Plating ukobvu (Technique:Kunyudzwa Ni/Au) Plating mhando: IMM Ni, Min./Max ukobvu:100/150U” Plating mhando: IMM Au, Min./Max ukobvu:2/4U”
Impedance control ± 10% Distance betweenmutsara kuenda kumucheto Mhedziso: 0.2mm V-CUT: 0.4mm
Base mhangura ukobvu (Inneruye yekunze layer) Min.ukobvu:1/3 OZ Max.ukobvu:6OZ Min.hole saizi(bhodhi ukobvu ≥2mm) Aspect ratio≤16
Yakapera mhangura ukobvu Mapepa ekunze:Min.hukobvu 1 OZ,Max.hukobvu 10 OZ

Inner layers:

Min.hukobvu 0.5OZ,

Max.ukobvu 6 OZ

Max.board ukobvu(kamwe&mativi maviri) 6mm

jkb (1) jkb (2) jkb (3) jkb (4) jkb (5)


  • Zvakapfuura:
  • Zvinotevera:

  • Nyora meseji yako pano ugotitumira