4 Layer PCB Kugadzira Prototype Yakachipa Mutengo PCB Mugadziri muChina
Product Details
Application: Electronics, mauto, mushonga, zvichingodaro
Chitupa: ISO/TS16949/ROHS/TS16949
Solder mask ruvara:Green Nhema Bhuruu White
Nhamba yeLayer: 1-22 Layers
Sevhisi: Nyanzvi injiniya, yakanaka mushure mesevhisi, mutengo wemakwikwi
PCB Standard:IPC-A-610 D/IPC-III Standard
Kushivirira kwegomba:PTH: ±2mil, NTPH: ±2mil
Bhodhi Makobvu Kushivirira: ± 10%
OEM/ODM Services: | |||
Layer | 1-22 layers | Min.upamhi hwemutsara | 2mil |
Max.board size (single&doubledivi) | 700*1200mm | Min.annular mhete hupamhi: visa | 3mil |
Surface finish | HAL (ine Pb yemahara), yakaiswa Ni/Au,Sirivha yakanyudzwa, IMM Ni/Au, I MM Sn,goridhe rakaoma, OSP, nezvimwewo | Min.board ukobvu(multilayer) | 4 layers:0.4mm;6 layers:0.6mm;8 layers:1mm; 10 layers:1.2mm |
Board zvinhu | FR-4;high TG;yakakwirira CTI;halogen yakasununguka;high frequency (rogers, ta-conic,PTFE,nelson,ISOLA, polyclinic 370 HR;mhangura gobvu | Plating ukobvu (Technique:Kunyudzwa Ni/Au) | Plating mhando: IMM Ni, Min./Max ukobvu:100/150U” Plating mhando: IMM Au, Min./Max ukobvu:2/4U” |
Impedance control | ± 10% | Distance betweenmutsara kuenda kumucheto | Mhedziso: 0.2mm V-CUT: 0.4mm |
Base mhangura ukobvu (Inneruye yekunze layer) | Min.ukobvu:1/3 OZ Max.ukobvu:6OZ | Min.hole saizi(bhodhi ukobvu ≥2mm) | Aspect ratio≤16 |
Yakapera mhangura ukobvu | Mapepa ekunze:Min.hukobvu 1 OZ,Max.hukobvu 10 OZ Inner layers: Min.hukobvu 0.5OZ, Max.ukobvu 6 OZ | Max.board ukobvu(kamwe&mativi maviri) | 6mm |
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