Kugona

FR4 Zvinogona:

Item Zvinotaurwa Nezvehunyanzvi
Material Type FR-1, FR-4, CEM-1, CEM-3, Rogers, ISOLA
Kukora Kwezvinhu 0.062”, 0.080”, 0.093”, 0.125”, 0.220”, 0.047”, 0.031”, 0.020”, 0.005”
Layer count 1 kusvika ku20 Layers
Max.Board Saizi 22.00" x 28.00"
IPC Kirasi Kirasi II, Kirasi III
Annular Ring 5 mil/side kana Huru (Min. Dhizaini)
Pedzisa Plating Solder(HASL), Lead Free Solder(L/F HASL), ENIG (ELectroless Nickel Imersion Gold), OSP,Immersion Silver,Immersion Tin,Immersion Nickel,Hard Gold,etc.
Copper Weight Kunze : Kusvika 7oz, mukati : kusvika 4 oz.
Trace/Space Width 3/3 miriyoni
Diki padhi saizi 12 miriyoni
Plated Slots 0.016"
Diki Gomba 8mil;4 miriyoni
Gold Fingers 1 kusvika 4 Edge (30 kusvika 50 Micron Goridhe)
Nhoroondo ye SMD 0.080”- 0.020”- 0.010”
Soldermask Type LPI Inobwinya, LPI-Matte
Soldermask Ruvara Girini, Tsvuku, Bhuruu, Nhema, Muchena, Yero, Pachena
Legend Color Ichena, Yero, Nhema, Tsvuku, Bhuruu.
Minimum Route Width 0.031"
Scoring (v-cut) Straight Lines, Jump Scoring, CNC V-CUT.
Ndarama HARD, SOFT, IMMERSION (kusvika pa50 MICRON GOLD)
Data File Format Gerber RS-274x ine embedder aperture.
Fab.Drawing Format Gerber Mafaira, DXF, DWG, PDF
Aspect ratio 10:01
Counter Sink / Counter Bore Ehe
Kudzora Impedence Ehe
Bofu Vias / Kuvigwa Vias Ehe
Peelable Mask Ehe
Carbon Ehe

MC PCB Kugona:

Item Zvinotaurwa Nezvehunyanzvi
Nhamba yezvikamu Single side, Double Sides, Four Layers MCPCB
Rudzi rwechigadzirwa Aluminium, Mhangura, Iron base MCPCB
Mupi we laminate Berquist, Ventec, Polytronics, Boyu, Wazam nezvimwe.
Pedzisa bhodhi ukobvu 0.2 ~ 5.0mm
Mhangura ukobvu Hoz-3oz
Mupi wemasolder mask Taiyo, Fotochem etc.
Ruvara rwe solder mask Ichena, Nhema, Tsvuku, Bhuruu, Yero etc.
Surface finish L/F HASL, OSP, ENIG, Electrolytic Silver, Immersion Tin, Immersion Silver etc.
Rudzi rwerondedzero yapera Kufambisa, Kurova, V-kucheka
Bow and twist ≤0.75%
Min hole size 1.0mm
Max.bhodhi saizi 1500mmX610mm
Min.bhodhi saizi 10mmX10mm