EMC Dhizaini Spark FR4 PCB Uye Iyo Yakadhindwa Circuit Board

Product Detail

Base Material:FR4

Hukobvu hwemhangura:1oz

Bhodhi Ukobvu: 1.6mm

Min.Gomba Kukura: 0.2mm

Min.Line Width: 0.1mm

Min.Line Spacing: 0.1mm

Kupedzisa Kwepamusoro: HASL

Solder Mask:Green

Silkscreen:Muchena

PCB Muedzo: Muedzo-rig, Flying Probe Muedzo

PCBA Muedzo: X-ray, AOI Muedzo, Inoshanda bvunzo

Chitupa:UL.ROHS.CE

Rudzi rwemasevhisi:Yakakwira Hunhu PCB Kugadzira

Keywords: isina PCB bhodhi mutengo

Service:One-stop Service

Layer:1-24 layers

Item	Tsanangudzo
1	Nhamba yeLayer	1-18Nzira
2	Material	FR-4,FR2.Ta-conic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
3	Surface Finish	HASL(LF), Gold plating, Electrolysis nickel immersion gold, Immersion Tin, OSP
4	Pedzisa Bhodhi Makobvu	0.2mm-6.00 mm(8mil-126mil)
5	Mhangura Kukora	1/2 oz min;12 oz max
6	Solder Mask	Green/Black/White/Red/Blue/Yellow
7	Min.Trace Width & Line Spacing	0.075mm/0.1mm(3mil/4mil)
8	Min.Hole Diameter yeCNC Drilling	0.1mm(4mil)
9	Min.Hole Diameter yekubaya	0.9mm(35mil)
10	Saizi huru yepaneru	610mm*508mm
11	Hole Position	+/-0.075mm(3mil) CNC Drilling
12	Conductor Width(W)	0.05mm(2mil) kana;+/-20% yepakutanga mifananidzo
13	Gomba Diameter(H)	PTH L:+/-0.075mm(3mil);ISISIRI-PTH L:+/-0.05mm(2mil)
14	Rondedzera Kushivirira	0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) neKurova
15	Warp & Twist	0.70%
16	Insulation Resistance	10Kohm-20Mohm
17	Conductivity	<50ohm
18	Test Voltage	10-300V
19	Panel Size	110×100mm(min);660×600mm(max)
20	Layer-layer ministration	4 layers:0.15mm(6mil)max;6 akaturikidzana:0.25mm(10mil)max
21	Min.spacing pakati pegomba kumucheto kune circuity pateni yemukati me layer	0.25mm(10mil)
22	Min.spacing between board outline circuitry pattern yemukati me layer	0.25mm(10mil)
23	Board ukobvu kushivirira	4 akaturikidzana:+/-0.13mm(5mil);6 akaturikidzana:+/-0.15mm(6mil)
24	Impedans Control	+/-10%
25	Different Impedance	+-/10%