Shenzhen yepamusoro mhando aluminium PCB MCPCB ine Taiyo PSR-4000 akatevedzana yakachena chena solder mask
Kukwanisa Kugadzira:
chinhu | Kugadzira Kugona |
Material | FR4, CEM-1, Aluminium, Poly amide |
Layer Nha. | 1-12 |
Yakapedzwa bhodhi ukobvu | 0.1 mamirimita-4.0mm |
Bhodhi Makobvu Kushivirira | ±10% |
Cooper ukobvu | 0.5 OZ-3OZ (18 um-385 um) |
Mhangura Plating Hole | 18-40 um |
Impedans Control | ±10% |
Warp&Twist | 0.70% |
Peel anogona | 0.012"(0.3mm)-0.02'(0.5mm) |
Images
Min Trace Width (a) | 0.075mm (3mil) |
Min Space Width (b) | 0.1mm (4 miriyoni) |
Min Annular Ring | 0.1mm (4 miriyoni) |
SMD Pitch (a) | 0.2 mm(8 miriyoni) |
BGA Pitch (b) | 0.2 mm (8 miriyoni) |
Solder Mask
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Solder mask Clearance (b) | 0.1mm (4 miriyoni) |
Min SMT Pad spacing (c) | 0.1mm (4 miriyoni) |
Solder Mask Ukobvu | 0.0007"(0.018mm) |
Makomba
Min Hole size (CNC) | 0.2 mm (8 miriyoni) |
Min Punch Hole Saizi | 0.9 mm (35 miriyoni) |
Gomba Kukura TOL (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position TOL | ± 0.075mm |
Plating
HASL | 2.5um |
Tungamira yemahara HASL | 2.5um |
Kunyudza Goridhe | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Outline
Panel Outline TOL (+/-) | CNC: ± 0.125mm, Kurova: ± 0.15mm |
Beveling | 30°45° |
Goridhe Finger angle | 15° 30° 45° 60° |
Chitupa | ROHS, ISO9001:2008, SGS, UL chitupa |
Tinogona kukuitira:
1-12 layer FR4 PCB.
1-2 layer aluminium PCB.
1-4layer inochinjika PCB.
CEM-1 PCB
94VO PCB
SMT uye DIP musangano sevhisi.
Nyora meseji yako pano ugotitumira