Multilayer redunhu mabhodhi anowanzo kutsanangurwa se 10-20 kana anopfuura epamusoro-giredhi multilayer edunhu mabhodhi, ayo anonetsa kugadzirisa kupfuura echinyakare multilayer edunhu mabhodhi uye anoda mhando yepamusoro uye kusimba.Inonyanya kushandiswa mumidziyo yekutaurirana, maseva epamusoro-soro, zvemagetsi zvekurapa, ndege, kutonga kwemaindasitiri, mauto uye mamwe minda.Mumakore achangopfuura, kudiwa kwemusika kweakawanda-layer circuit board muminda yekutaurirana, base stations, aviation, uye mauto zvichiri kusimba.
Kuenzaniswa nezvigadzirwa zvePCB zvechinyakare, mabhodhi ematunhu mazhinji ane hunhu hwebhodhi gobvu, mamwe matinji, mitsetse yakakora, yakawanda kuburikidza nemaburi, saizi huru yeyuniti, uye yakatetepa dielectric layer.Zvepabonde zvinodiwa zvakanyanya.Iri pepa rinotsanangura muchidimbu matambudziko makuru ekugadzirisa akasangana mukugadzirwa kwepamusoro-level redunhu mabhodhi, uye inosuma mapoinzi akakosha ekutonga kweakakosha maitiro ekugadzira e multilayer circuit board.
1. Zvinetso mukurongeka kwemukati-kati
Nekuda kwehuwandu hukuru hwematanho mune akawanda-layer redunhu bhodhi, vashandisi vane yepamusoro uye yepamusoro zvinodiwa pakugadziriswa kwePCB layer.Kazhinji, kushivirira kwekuenzanisa pakati pezvikamu kunoshandiswa pa75 microns.Tichifunga nezvehukuru hukuru hweakawanda-layer circuit board unit, tembiricha yepamusoro uye humidity muiyo graphics conversion workshop, dislocation stacking inokonzerwa nekusaenderana kwemabhodhi epakati akasiyana, uye interlayer positioning nzira, iyo centreing control yeakawanda-layer. bhodhi redunhu rinowedzera kuoma.
Multilayer circuit board
2. Matambudziko mukugadzirwa kwematunhu emukati
Multilayer redunhu mabhodhi anoshandisa zvakakosha zvinhu zvakaita seyakakwira TG, kukurumidza, yakakwira frequency, gobvu mhangura, uye yakaonda dielectric layer, iyo inoisa kumberi kwepamusoro zvinodiwa zvemukati wedunhu kugadzira uye graphic saizi kutonga.Semuenzaniso, kuvimbika kweiyo impedance chiratidzo chekufambisa kunowedzera kuoma kwekugadzirwa kwemukati wedunhu.
Iyo hupamhi uye mutsara wemitsara idiki, yakavhurika uye mapfupi maseketi anowedzerwa, mapfupi maseketi anowedzerwa, uye chiyero chekupasa chakaderera;kune akawanda masignal layers emitsara yakatetepa, uye mukana weAOI yekuona kubuda kwemvura mukati memukati inowedzerwa;iyo yemukati yepakati bhodhi yakatetepa, iri nyore kuunyana, isina kunaka kuratidzwa, uye iri nyore kupeta kana etching muchina;Mahwendefa epamusoro-soro anowanzo mapuranga ehurongwa, saizi yeyuniti yakakura, uye mutengo wekuraswa kwechigadzirwa wakakwira.
3. Matambudziko muCompression Manufacturing
Mazhinji emukati epakati mabhodhi mabhodhi uye prepreg mapuranga akaiswa pamusoro, ayo anongopa zvibodzwa zvekutsvedza, delamination, resin voids uye bubble masara mukugadzira zvitambi.Mukugadzirwa kwechimiro chelaminate, kupikisa kupisa, kupikisa kumanikidza, glue yemukati uye dielectric ukobvu hwezvinhu zvinofanirwa kutariswa zvizere, uye inonzwisisika yakawanda-layer redunhu redunhu bhodhi zvinhu kudzvanya hurongwa hunofanira kugadzirwa.
Nekuda kwehuwandu hukuru hwematanho, iyo yekuwedzera uye kudzora kudzora uye saizi coefficient muripo haigone kuchengetedza kuenderana, uye yakaonda interlayer insulating layer iri nyore, izvo zvinotungamira kukundikana kweiyo interlayer kuvimbika kuedza.
4. Matambudziko mukugadzira kugadzira
Iko kushandiswa kweyakakwira TG, kumhanya kwakanyanya, yakakwira frequency, uye gobvu mhangura yakakosha mahwendefa inowedzera kuoma kwekuchera roughness, kudhirowa maburrs uye decontamination.Huwandu hwezvikamu zvakakura, huwandu hwemhangura hwemhangura uye ukobvu hweplate hunounganidzwa, uye chishandiso chekuchera chiri nyore kutyora;dambudziko rekukundikana kweCAF rinokonzerwa neBGA yakapararira uye nzvimbo yakamanikana yemadziro;dambudziko rekuchera oblique rinokonzerwa nehombe yeplate iri nyore.PCB redunhu bhodhi
Nguva yekutumira: Jul-25-2022