Kutengesa Kupisa HDI Multilayer FR4 PCB Circuit Boards For Micro SD Card
Quick Details:
Hukobvu hwemhangura: 1 oz
Bhodhi Ukobvu: 1.0mm
Min.Gomba Kukura: 0.20mm
Min.Line Width: 0.075mm
Min.Mutsetse Wepakati:0.075mm
Kupedza Kwepamusoro: ENIG
Bhodhi Size: Yakagadzirirwa
Solder mask Ruvara:Green Ink
Bhodhi Makobvu Kushivirira:+/- 10%
V-cheka kona:25°,30°,45°,60°
Twist&Wrap:≤ 0.5%
Faira:Pro tel 99se/P-CAD/Auto cad/Cam350
Kurongedza kwemukati: Vacuum kurongedza, Plastic bag
Kurongedza kunze: Yakajairwa katoni kurongedza
Sevhisi: PCB & PCBA
Layer: 6 layer
Silk mask:Ichena
Products Description
1 | Tsanangudzo | PCB tsanangudzo |
2 | Material | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminium |
3 | Layer | 1-20 |
4 | Bhodhi Ukobvu | 0.2mm-4.0mm |
5 | Bhodhi Makobvu Kushivirira | +/-10% |
6 | Mhangura ukobvu | 17.5um-175um (0.5oz-5oz) |
7 | Min Trace Width | 0.15mm |
8 | Min Space Width | 0.15mm |
9 | Min Drilling Dia | 0.2mm |
10 | PTH mhangura ukobvu | 0.4-2mil(10-50um) |
11 | Kushivirira kweEtching | ±1mil(±25um) |
12 | V-cut angle | 25°,30°,45°,60° |
13 | Pearl Simba remutsara | ≥ 6lb/mu(≥ 107g/mm) |
14 | Impedance kutonga uye kushivirira | 50Ω±10% |
15 | Twist&Wrap | ≤ 0.5% |
16 | Solder mask | Green, Red, Blue, White, Black, Yellow |
17 | Pamusoro Pedzisa / Kuputira | HASL/Lead Yemahara HASL/OSP/Gold Plating/Immersion Gold/ENIG |
18 | Chitupa | ROSH.ISO9001 |
19 | File | Protel 99se/P-CAD/Auto cad/Cam350 |
20 | Kurongedza kwemukati | Vacuum packing, Plastic bag |
21 | Kurongedza kwekunze | Standard carton kurongedza |
Our Factory:
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