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High Power LED Traffic Chiedza PCB uye Electronic Components Stores

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Product Detail

Product Details

Base Material: FR-4, FR2.Taconic, Rogers

Mhangura Ukobvu: 1/2 oz min;12 oz max

Bhodhi Ukobvu: 0.2mm-6.00 mm(8mil-126mil)

Min.Gomba Kukura: 0.1mm(4mil)

Min.Mutsara Upamhi: 0.075mm(3mil)

Min.Mutsetse Wepakati: 0.1mm4mil)

Kupedzisa Kwepamusoro: Kunyudza Goridhe / Au, HASL, OSP, nezvimwe.

Warp & Twist: 0.7%

Gomba Position: +/-0.075mm(3mil) CNC Drilling

Insulation Resistance: 10Kohm-20Mohm

Conductivity: <50ohm

Test Voltage: 10-300V

ANCE Kudzora: +/-10%

Yakasiyana Impenitence: +-/10%

Outline Kushivirira: +/-0.125mm(5mil) CNC Routing +/-0.15mm(6mil) nePunching

Gomba Diameter(H) PTH L: +/-0.075mm(3mil) HAISI-PTH L: +/-0.05mm(2mil)

Conductor Width(W): +/-20% yepakutanga artwork PTH L: +/-0.

Masevhisi Edu

Isu tinogona kupa imwe-stop sevhisi:

1. PCB redunhu mabhodhi.

2. E-bvunzo.

3.Electronic components kutenga.

4. PCB musangano: inowanikwa pa SMT, BGA, DIP.

5. PCBA basa rekuongorora.

6. Enclosure assembly.

PCB chigadzirwa Kugona

PCB Manufacture Capacity
Item	Tsanangudzo
Material	FR-4, FR1,FR2;CEM-1, CEM-3, Rogers, Teflon, Arlon, Aluminium Base, Copper Base, Ceramic, Crockery, nezvimwewo.
Mashoko	Yepamusoro Tg CCL Inowanikwa(Tg>=170℃)
Pedzisa Bhodhi Makobvu	0.2 mamirimita-6.00mm(8mil-126mil)
Surface Finish	Chigunwe chegoridhe(>=0.13um), Kunyudza Goridhe(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
Shape	Routing, Punch, V-cut, Chamfer
Surface Treatment	Solder Mask (dema, girini, chena, tsvuku, bhuruu, ukobvu> = 12um, Block, BGA)
	Silkscreen (dema, yero, chena)
	Peel inokwanisa-mask (tsvuku, bhuruu, ukobvu> = 300um)
Minimum Core	0.075mm(3mil)
Mhangura Kukora	1/2 oz min;12oz max
Min Trace Width & Line Spacing	0.075mm/0.075mm(3mil/3mil)
Min Hole Diameter yeCNC Drilling	0.1mm(4mil)
Min Hole Diameter yePunching	0.6mm(35mil)
Saizi huru yepaneru	610mm * 508mm
Hole Position	+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)	+/-0.05mm(2mil) kana +/-20% yepakutanga
Gomba Diameter(H)	PTHL:+/-0.075mm(3mil)
Gomba Diameter(H)	Kwete PTHL:+/-0.05mm(2mil)
Rondedzera Kushivirira	+/-0.1mm(4mil) CNC Routing
Warp & Twist	0.70%
Insulation Resistance	10Kohm-20Mohm
Conductivity	<50ohm
Test Voltage	10-300V
Panel Size	110 x 100mm(min)
Panel Size	660 x 600mm(max)
Layer-layer misrepresentation	4 akaturikidzana:0.15mm(6mil)max
Layer-layer misrepresentation	6 akaturikidzana:0.25mm(10mil)max
Min spacing pakati pegomba kumucheto wecircuitry pateni yemukati me layer	0.25mm(10mil)
Min spacing pakati peboard outline kune circuitry pateni yemukati layer	0.25mm(10mil)
Board ukobvu kushivirira	4 akaturikidzana:+/-0.13mm(5mil)