Yakananga yekupisa nzira MCPCB uye Sink-pad MCPCB, Copper Core PCB, Copper PCB
Product Details
Base Material:Alu/ mhangura
Kukora kwemhangura:0.5/1/2/3/4 OZ
Bhodhi Ukobvu: 0.6-5mm
Min.Gomba Diameter: T / 2mm
Min.Line Width: 0.15mm
Min.Line Spacing: 0.15mm
Kupedzwa Kwepamusoro: HASL, Kunyudzwa goridhe, Flash goridhe, sirivha yakapfava, OSP
Zita rechinhu: MCPCB LED PCB Yakadhindwa redunhu bhodhi, Aluminium PCB, copper core
PCB
V-cheka Angle:30°,45°,60°
Kushivirira kwechimiro:+/-0.1mm
Gomba DIA kushivirira:+/-0.1mm
Thermal Conductivity: 0.8-3 W/MK
E-test voltage: 50-250V
Peel-off simba: 2.2N/mm
Warp kana twist:
PTH Wall ukobvu:> 0.025mm
| Aihwa. | Items | Index |
| 1 | Surface Treatment | HASL, Kunyudzwa goridhe, Mwerego goridhe, akapfachukira sirivheri, OSP |
| 2 | Layer | Single-side |
| 3 | PCB Ukobvu | 0.6-5mm |
| 4 | Copper Foil Chirwere | 0.5-4Oz |
| 5 | Min gomba dhayamita | T/2mm |
| 6 | Min Line width | 0.15mm |
| 7 | Layer | 1-4 zvikamu |
| 8 | Max board size | 585mm * 1185mm |
| 9 | Min board size | 3mm*10mm |
| 10 | Board ukobvu | 0.4-6.0mm |
| 11 | Min space | 0.127mm |
| 12 | PTH rusvingo ukobvu | >0.025mm |
| 13 | V-kucheka | 30/45/60 dhigirii |
| 14 | V-kucheka saizi | 5mm*1200mm |
| 15 | Min.bag pad | 0.35mm |
Mupiro: single sided MCPCB, double sided MCPCB, double layer MCPCB, bendable MCPCB, direct thermal exchange MCPCB, eutectic bonding flip -chip MCPCB.MCPCB yedu yakagadziridzwa.
1.aluminum base PCB LED chiedza led chiedza module yakatungamirira
2.aruminiyamu substrate PCB
3.aluminium base mhangura-akapfeka laminate PCB
4.aluminium base PCB
1) zvinhu: FR-4, Copper, Aluminium yakavakirwa
2) mutsetse: 1-4
3) mhangura ukobvu: 0.5oz, 1.0oz, 2oz, 3oz, 4oz
4) pamusoro pekupedzisira: HASL, OSP, Kunyudza Goridhe, Kunyudzwa sirivha, Flash goridhe, Plated sirivheri.
5) solder mask color: Green, dema, chena.
6) V-cheka kona: 30, 45,60 dhigirii
7) E-bvunzo voltage: 50-250V
8) Chitupa: UL, ISO9001, ROHS, SGS, CE
MC PCB Unyanzvi Kugona
| ;Type | Item | Capacity | Type | Item | Capacity |
| Layer | / | 1-4 | Hole size | Kuboora gomba saizi | 0.6-6.0mm |
| Laminate | Laminate mhando | Aluminium, iron, uye mhangura yekuzviparadzanisa yega base | Gomba kushivirira | ± 0.05mm | |
| Dimension | 1000*1200mm 60081500mm | Kushivirira kwegomba chinzvimbo | ±0.1mm | ||
| Board ukobvu | 0.4mm-3.0mm | Aspect ratio | 5:1 | ||
| Kushivirira kwebhodhi ukobvu | ±0.1mm | Solder mask | Min solder zambuko | 4mil | |
| Dielectric ukobvu | 0.075-0.15mm | Impedance | Impedans kushivirira | ±10% | |
| Circuit | Min width/ space | 5mil/5mil | Peel simba | ≥1.8 N/mm | |
| Kushivirira kwehupamhi / nzvimbo | ±15% | Surface resistance | ≥1*105M | ||
| Mhangura ukobvu | Mukati nekunze | 0.5-10 OZ | ≥1*106M | ||
| Volume resistivity | |||||
| Thermal conductivity | Low kupisa conductivity 1.0-1.5 | ||||
| Pakati kupisa conductivity 1.5-1.8 | |||||
| High conductivity 2.0-8.0 | |||||
| Solder fioat | 260 ℃, 10mil, Hapana blister, Hapana kutsunga | ||||
| Mvumo | ≤4.4 | ||||
